Advanced film deposition down to atomic layers/stacks, ALD&CVD by Oxford Instruments, sponsored by
Wallenberg Initiative Materials Science for Sustainability
ALD Atomfab PlasmaPro (OxInst)
Plasma-enhanced atomic layer deposition system for high quality materials, such as Ti-N, Nb-N, Al-O, Hf-O, including ultra-thin quantum materials and multilayers, that can be deposited at speed, with flexibility to run multiple chemistries and incorporation into devices:
- high material quality at 3x faster than conventional remote plasma
- reduced precursor consumption, small budget and environmental footprint
- low cost of ownership, improved serviceability and maintenance
- low volume chamber for speed
- low substrate damage
- higher process stability
ICPCVD PlasmaPro (Oxinst)
Chemical vapor deposition system for growing films at low temperature through high-density remote plasma, achieves superior film quality with low substrate damage: Si oxide, nitride, carbide, amorphous Si, variety of other materials possible (via addon modules):
- excellent uniformity, high precision, high throughput
- wide temperature range electrode, capability from -150 to 400 C
- all wafer sizes up to 200 mm, rapid change between sizes
- in-situ chamber cleaning and end-point
- flexible vapor delivery module enables liquid precursors, e.g. TiO2, SiO2
Contact our engineers for more information and training/booking; see examples of work done at ANL.
NEW: Inauguration of WISE ATOMFAB at Albanova Nanolab — 18 Sep 2026 at 13:30
ANL and WISE technology platform invite you to the inauguration of the new infrastructure at KTH-Albanova.
- 13:30 to 14:00 – cutting the ribbon
- 14:00 to 15:00 – user cases for the infrastructure, brief presentations by ANL researchers
- 15:00 to 16:00 – informal discussions, with food & drink