Electron Beam Lithography, Scanning Electron Microscopy, Focused Ion Beam Milling, Photolithography, Optical profilometry.
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Raith Voyager EBL System including “traxx” (FBMS) and “periodixx” (MBMS)
50 kV acc. voltage, beam currents up to 40 nA
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FEI Nova 200 Dual beam system (SEM/FIB)
Pt-deposition, 3D reconstruction with Slice and View, Kleindiek micro manipulators
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EDX system Oxford UltimMax/AZtec for SEM-based element analysis
Real time chemical imaging
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Direct Laser Writer MLA 150 Maskless Aligner
Laser 375 nm, min. feature size 0.6 um, Backside Alignment
installation spring 2021 -
Maskless Lithography system SmartPrint
For g-line photo resists, min. feature size 2 µm
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Karl Süss Contact Mask Aligner MJB3
max 2 inch wafer size, 3 inch masks
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Optical Profiler, gbs SmartVIS3D
Fixed 10 × objective, view area 1×1 mm, 25 nm vertical resolution