Film deposition, resist spinning, resist bake, developing, lift-off, characterization using optical microscopy including differential interference contrast, stylus profilometry;
plasma etching using various techniques and chemistries.
- RIE Oxford Plasmalab 100, cryo, CF4, CHF3, SF6, Cl2, Ar, O2, He-backside cooling, Laser Endpoint Detection
- RIE Oxford Plasmalab 80+, Ar, O2, with ICP 85
- Stylus Profilometer KLA Tencor P7
- EMS 4000 Spin Coater
- EMS 6000 Spin Coater
- Schaefer Tec SCE-15 Spin Coater
- EMS Hotplate
- Nikon ME600 Optical microscope, DIC, DF, 3 Mpix camera
- Nikon ME600 Optical Microscope, DIC, DF, 5 Mpix camera
- Nikon Stereo Microscope
- Millipore MilliQ Reference Clean Water System
- AJA ATC-1800-HY UHV Multi-Technique (e-gun/sputter) Deposition System
- AJA Orion Sputtering System, eight 2-inch targets, Ar, N2, O2
- AJA-2 ATC 2200 Sputtering System, four 3-inch targets, Ar, N2, O2
- AJA-3 Orion Sputtering System, seven 2-inch targets, Ar, N2, O2
- Kenosistec HV door-access chamber with 4-pocket e-gun
- AGAR SEM Carbon coater
- Paroteq Flip-Chip Bonder